Other concept stocks used for sealing and testing include:
Deep technology: The company belongs to the electronic information manufacturing service (EMS) industry, providing customers with high-quality electronic product R&D and manufacturing services. The company's main business includes providing advanced manufacturing services for computers and storage, solid-state storage, communications, consumer electronics, medical equipment and other electronic products, as well as R&D and metering systems, production of automation equipment and semiconductor sealing and testing services.
Huatian Technology: 2065438+announced in July 2008, the company plans to invest in the construction of Nanjing advanced integrated circuit packaging and testing industrial base project in Nanjing Pukou Economic Development Zone.
Han Wei Science and Technology: 2020 quarterly announcement disclosure; The MEMS product line has been put into production smoothly, and the company has mastered the core chip design technology, and is ready to build a MEMS sealing and testing production line, effectively opening up the technical and market channels for product upgrading.
Shuobeide: Force fingerprint identification module manufacturing and chip packaging test. 20 14, the company successively held shares in Keyang Electric, Kunshan Kaier and the newly established Huizhou Kaier, and quickly cut into the fields of sensor packaging, molding and manufacturing; Industry leader in antenna field.
Guangli Technology: mainly engaged in safety production monitoring and energy conservation and environmental protection business, semiconductor packaging and testing equipment manufacturing business; As a private military supporting enterprise, Changshu yabang, a wholly-owned subsidiary, is currently the main supplier of domestic military engineering equipment (electronic control system of pontoon bridge and training simulator), and its main customer is the general assembly unit of military engineering equipment (pontoon bridge) in China.
Li Ande Equipment: In April 2020, the company plans to issue shares to build a semiconductor packaging and testing intelligent equipment construction project.
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