Cui Zheng graduated from Southeast University (formerly Nanjing Institute of Technology) with a bachelor's degree (198 1), a master's degree (1984) and a doctor's degree (1988). 65438-0989 was funded by the Visiting Research Fund of the National Science and Engineering Research Council of the United Kingdom, and went to the Microelectronics Research Center of Cambridge University in the United Kingdom to do postdoctoral research. 1993, worked as a senior researcher at the Microstructure Center of Rutherford National Laboratory, UK. 1999, served as the chief scientist of micro-nano technology, and once served as the head of micro-system technology center. Now he is responsible for the engineering application of micro-nano technology. For more than ten years, he has participated in eight European isomorphism joint research projects and served as the host of two of them. Member of the Project Committee of the Annual Meeting of European MEMS/LLM Design, Testing, Integration and Packaging, editor of the International Journal of Micro-nano Lithography, MEMS and LLM, expert in the evaluation of nanotechnology subprojects of the Seventh Framework Research Plan of Europe, and expert in the evaluation of British national scientific research projects, and has been invited to evaluate papers for various academic journals for many times; Member of British Physical Society and Senior Member of Engineering Technology Society (IET). Since 1994, we have cooperated with China and been employed as visiting researchers and professors in many domestic scientific research units and universities. He has been sponsored by Wang Kuancheng Scientific Research Award for four times and returned to China for cooperative research and lectures. 200 1 Up to now, he has presided over two Sino-British joint research projects funded by the Royal Society. In 2002, he was hired as an overseas evaluation expert of China Academy of Sciences. In 2004, he was awarded the China Academy of Sciences Overseas Outstanding Scholar (Class B) Fund. In 2007, he participated in the overseas cooperation team of nano-electronic materials and devices of Institute of Physics, Chinese Academy of Sciences. Book Catalogue 1. 1 Micro-nano Technology and Micro-nano Processing Technology

1.2 classification of micro-nano machining technology

1.3 Content and structure of this book

Reference 2. 1 Introduction

2.2 Optical exposure mode and principle

2.2. 1 mask alignment exposure

Projection exposure

2.3 Optical exposure process

2.4 Characteristics of Photoresist

General characteristics of photoresist

2.4.2 Comparison of Positive Rubber and Negative Rubber

2.4.3 Chemical amplification glue

2.4.4 Special photoresist

2.5 Design and Manufacture of Optical Mask

2.6 short wavelength exposure technology

2.6. 1 deep ultraviolet exposure technology

2.6.2 Extreme ultraviolet exposure technology

X-ray exposure technique

2.7 Large numerical aperture and immersion exposure technology

2.8 Optical Exposure Resolution Enhancement Technology

2.8. 1 Off-axis lighting technology

Spatial filtering technology

Phase shift mask technology

2.8.4 optical proximity effect correction technology

2.8.5 Manufacturing-oriented mask design technology

2.8.6 Photoresist and its processing technology

2.8.7 Double exposure and processing technology

2.9 Computer simulation technology of optical exposure

2.9. 1 partially coherent imaging theory

2.9.2 Comparison of Computer Simulation Software

2.9.3 Comparison of Optical Exposure Quality

2. 10 Other optical exposure technologies

2. 10. 1 near-field optical exposure technology

2. 10.2 interference exposure technology

2. 10.3 maskless optical exposure technology

2. 10.4 Laser 3D Micro-Forming Technology

2. 10.5 gray exposure technology

2. 1 1 thick glue exposure technology

2. 1 1. 1 traditional photoresist

2. 1 1.2 SU-8 photoresist

2. 12 LIGA technology

2.12.1liga x-ray source

2.12.2 x-ray UIGA mask

2. 12.3 thick x-ray LIGA adhesive and its process

2. 12.4 factors affecting the accuracy of x-ray uGA graphics

Reference 3. 1 Introduction

3.2 Principles of Electron Optics

3.2. 1 electron lens

electron gun

3.2.3 Electron optical aberration

3.3 Electron beam exposure system

3.4 Design and data format of electron beam exposure pattern

3.4. 1 Design considerations

Intermediate data format

3.4.3 AutoCAD data format

Machine data format

3.5 Scattering of Electron Beam in Solid Materials

3.6 Proximity Effect of Electron Beam Exposure and Its Correction

3.7 Low Energy Electron Beam Exposure

3.8 Electron beam resist and its process

3.8. 1 high resolution electron beam photoresist

3.8.2 chemically amplified photoresist

Special development process

Multilayer resist process

3.9 Limit resolution of electron beam exposure

3. Computer simulation of10 electron beam exposure

3. 1 1 special electron beam exposure technology

3. 1 1. 1 deformed beam exposure

3. 1 1.2 electron beam projection exposure

3. 1 1.3 Multi-electron beam exposure

3. 1 1.4 Micro-beam system exposure

Reference 4. 1 Introduction

4.2 Liquid metal ion source

4.3 focused ion beam system

4.4 Ion Scattering in Solid Materials

4.5 Principle of focused ion beam machining

4.5. 1 ion sputtering

Ion beam assisted deposition

4.6 Application of focused ion beam machining technology

4.6. 1 Review and modify integrated circuit chips

4.6.2 Repair defects of optical mask

4.6.3 Preparation of Transmission Electron Microscope Samples

4.6.4 Multi-purpose Micro Cutter

4.7 focused ion beam exposure technology ..

4.8 focused ion beam implantation technology

Reference 5. 1 Introduction

5.2 scanning probe microscope principle

5.3 resist exposure treatment

5.3. 1 scanning tunneling microscope exposure

NSOM risk exposure

5.4 Local oxidation treatment

5.5 Adding Nano-machining

5.5. 1 scanning probe field deposition

5.5.2 Scanning Probe Dot Ink Lithography

5.6 Reduce nano-machining

5.6. 1 electrochemical etching treatment

5.6.2 Field decomposition treatment

Thermal indentation treatment

Mechanical scratch treatment

5.7 High-yield scanning probe processing

Reference 6. 1 Introduction

6.2 Hot-pressing nano-imprint technology

6.2. 1 Hot-pressed nano-imprint stamp

6.2.2 Hot embossing materials

6.2.3 demoulding of hot-pressed nano-imprint.

6.2.4 Alignment of Hot-pressing Nano-imprint Lithography

6.3 Room Temperature Nano-imprint Technology

6.4 UV curing nano-imprint technology

6.4. 1 transparent impression

6.4.2 UV curing imprinting material

6.4.3 Step flash imprint lithography technology

6.4.4 Alignment of Transparent Stamp

6.4.5 exposure-imprint lithography

6.5 Reverse Nano-imprint Technology

6.6 Soft Lithography Technology

Soft lithography seal

Micro-contact printing

6.6.3 Capillary Force Assisted Injection Molding

6.7 Plastic Micro-molding Technology

6.7. 1 hot pressing

Micro injection molding

Casting and forming

Reference 7. 1 Introduction

7.2 Thin Film Deposition Technology

7.3 dissolution stripping method

7.4 electroplating method

7.5 Embedding method

7.6 template method

7.7 inkjet printing method

Reference 8. 1 Introduction

8.2 Chemical Wet Etching Technology

Anisotropic corrosion of silicon

8.2.2 Isotropic Corrosion of Silicon

8.2.3 Isotropic Corrosion of Silicon Dioxide

8.3 One of dry etching: reactive ion etching.

8.3. 1 principle of reactive ion etching

8.3.2 Process parameters of reactive ion etching

8.4 Dry etching II: reactive ion etching.

8.4. 1 Inductively coupled plasma etching system

Bosch process

8.4.3 Deep Etching of Nanostructures

8.4.4 Problems in Reactive Ion Etching

8.5 dry etching III: plasma etching

8.6 dry etching IV: ion sputtering etching

8.7 Dry Etching 5: Reactive Gas Etching

8.8 Dry etching VI: Other physical etching techniques

8.8. 1 laser micromachining technology

8.8.2 EDM micro-machining technology

8.8.3 Powder spraying micromachining technology

Reference 9. 1 Introduction

9.2 sidewall deposition method

9.3 transverse subtraction

9.4 horizontal addition

9.5 vertical subtraction

9.6 nanosphere array method

9.7 Multi-step processing method

9.8 super-resolution method

Reference 10. 1 Introduction

10.2 self-assembly process

Molecular self-assembly of 10.2. 1

Self-assembly of 10.2.2 nanoparticles

10.3 controllable self-assembly

10.3. 1 surface shape orientation

10.3.2 surface energy guidance

10.3.3 electrostatic force guidance

10.3.4 magnetic guidance

Basic structural unit of 10.4 nanometer system

10.4. 1 DNA framework

10.4.2 carbon nanotubes

10.4.3 block * * * polymer

10.4.4 porous alumina

Reference 1 1. 1 Introduction

1 1.2 VLSI technology

1 1.3 Nanoelectronic Technology

1 1.4 optoelectronic technology

1 1.5 high-density magnetic storage technology

1 1.6 MEMS technology

1 1.7 biochip technology

1 1.8 nanotechnology

refer to

index

Concluding remarks ...