First of all, the sand used to make CPU is not the sand we can see everywhere. It is dug from a special mine, and its purity is much higher than that of ordinary sand. Purity is so important because with the progress of science and technology. The transistors on the CPU are getting smaller and smaller. In this way, more transistors can be installed in each chip, so the performance is stronger. Because today's chip manufacturers are trying to insert as many transistors as possible into the chip. The fault tolerance range becomes very small. At this time, extremely precise technology and completely dust-free production environment are needed.

These sands have been purified by thousands of degrees Celsius and chemicals and turned into completely pure silicon columns.

These silicon pillars are cut again and cut into wafers one by one. Then through the designed mold with ultraviolet radiation. Make the chip into the shape designed by the engineer

Because wafers are generally large (for CPU chips). Therefore, the wafer can be irradiated many times. A chip that can hold hundreds of CPU chips.

After the irradiation is completed, the wafer will be cleaned in a specific solvent to remove the part irradiated by ultraviolet rays, and then the remaining part will be impacted by ions to change its characteristics, that is, only current will be allowed to pass in one direction. Therefore, a transistor is formed.

After the transistors are formed, the next step is to connect these transistors to make them work, and make very thin wires to connect each transistor through ultraviolet engraving process. The specific connection method depends on the CPU architecture designed by engineers, such as AMD's ZEN architecture and INTEL's Skylake architecture.

These copper wires are interwoven with many layers,

Next, the final chip test will be carried out. . After the test is completed, the passed CPU will be embedded in the PCB of the CPU. Then connect the interface. Cover the package.

At this time, even if a CPU is made.