The difference between first opening and first slotting in metal process in the middle and late stage of semiconductor manufacturing process

In the semiconductor manufacturing process, the difference between opening first and slotting first in the metal process is as follows:

1. Opening first means opening in the dielectric layer before depositing metal, and then depositing metal into the hole. The process usually includes etching stop layer, oxidation, oxide deposition, physical vapor deposition or chemical vapor deposition. The advantage of opening holes first is that it can optimize the resistance of metal wires, better control the conductivity and reduce the capacitive coupling between metal wires. In addition, opening holes first can improve the tolerance of the filling process and reduce the difficulty of the process.

2. Slotting first means etching a groove on the dielectric layer first, and then depositing metal to fill the groove. The process usually includes steps such as dry etching or wet etching. The advantage of slotting first is that the integration of the chip can be improved, because thinner lines can be etched. In addition, grooving first can also improve the controllability of the process and make it easier to realize global planarization.

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