Put the welding wire on the workpiece and melt an appropriate amount of solder. In the process of feeding solder, the solder can first contact the welding head and then move to the position opposite to the welding head, which is beneficial to the melting of solder and the conduction of heat. At this time, pay attention that the solder must wet the surface of the workpiece to be welded and the whole pad.
After the pad is filled with solder, quickly remove the bonding wire. Immediately after the amount of solder meets the requirements, lift the bonding wire upward along the lead direction of the component.
After the solder expansion range meets the requirements, remove the soldering iron, pay attention to the speed of removing the soldering iron, and the evacuation direction should be lifted up along the direction of the component lead.
Extended data
1, after welding, check whether there is short circuit or missing welding between pins of the integrated circuit. When checking, you can use a magnifying glass or multimeter to detect. If there is missing welding, repair welding with a pointed soldering iron, and finally clean the rosin around the integrated circuit with anhydrous alcohol.
2. Reduce the length of parallel signals and reasonably set the number of wiring layers and spacing. Crosstalk can be effectively reduced by shortening the distance between signal layer and plane layer, increasing the distance between signal lines and reducing the length of parallel signal lines (within the critical length range).
3. In the process of using the road board, the pad often falls off, especially when repairing the circuit board, and it is very easy to fall off when using the soldering iron. In this paper, the circuit board factory analyzes the reasons of pad falling off.
Baidu encyclopedia-welding
Baidu encyclopedia-circuit board