Networking ability
Qualcomm Snapdragon 855 can provide gigabit networking capability, equipped with Qualcomm Snapdragon X50 5G modem chip, and supports 5G networking in Sub-6GHz and millimeter wave bands; Taking millimeter wave as an example, users can expect the average efficiency to be 20 times faster than some existing commercial solutions. In addition, the built-in Snapdragon X24 LTE modem chip can provide 4G network capability up to 2Gbps.
Efficiency performance
Qualcomm Snapdragon 855 adopts Kryo 485 CPU architecture based on ARM Cortex-A76, which improves the performance by 45% compared with the previous generation Qualcomm Snapdragon 845. In addition, equipped with Adreno 640 GPU, the image processing speed is increased by 20%. By supporting Vulkan 1. 1, high dynamic range imaging (HDR) and physical realistic rendering (PBR), the e-sports experience using Adreno image technology will reach a new standard of image realism.
artificial intelligence
Qualcomm Snapdragon 855 is equipped with the fourth-generation multi-core Qualcomm artificial intelligence engine (Qualcomm AI engine), providing a total computing power of more than 7 TOPs per second, and the AI efficiency is three times that of Qualcomm Snapdragon 845; In addition, Qualcomm's software development toolkit, Google's Android NN-API, Hexagonn and Qualcomm's math library have also been enhanced.
So it is relatively mature.
Everyone knows that every generation of craftsmen is a generation of gods, but there is also a saying that every generation of craftsmen is a generation of gods.
14nm and 7nm are standard full generation processes, and 10nm is half generation processes.
As far as Samsung is concerned, each generation of processes is divided into LPE, LPP, LPC and LPU processes.
Generally speaking, a large number of market-oriented films are LPE and LPP processes, and LPC and LPU are hardly seen. Because the process is updated too quickly, it is not necessary to have better LPC and LPU under the pressure of LPP, because the upgrade process is as difficult and expensive as the upgrade process.
Xiaolong 835 10nm LPE (Samsung)
Snapdragon 845 10nm LPP (Samsung)
However, there are some problems in Samsung's 7nm EUV process, so at present, Samsung only has 8nm LPP process.
So the 855th generation factory is TSMC.
For TSMC, the current relatively complete process is 16nm, which TSMC divides into the first generation16 nm finfet (16 nm ff), the second generation16 nm finfet plus (16 nm+) and the third generation/kloc-.
Snapdragon 855 uses TSMC 7 nm FinFET (without EUV technology).
As for why Samsung is obsessed with extreme ultraviolet lithography technology and the influence of EUV on the chip, I won't discuss it in depth here. If you want to know, search for it yourself.
At present, Snapdragon 855 TSMC's 7nm FinFET can be speculated to be the level of Samsung's 7nm LPE process in the future.