1983.09—— 1985.08 Assistant Engineer of Shenyang Standard Parts Company.
1985.09—— 1988.02 Master of Materials Science, Master of Engineering, Northeastern University.
1988.02 ——1989.438+02 Assistant Research Fellow of Northeastern University.
1990.05438+0 ——1992.11lecturer of northeastern university
1992.12 ——1994.09 Associate Professor, Northeastern University.
1995.04—— 1998.03, Ph.D. in materials science, Tohoku University, Japan.
1998.04——2000.03 Senior Research Fellow, Japan New Energy Industry Technology Research Institute.
2000.02—2000.03 Visiting Professor, University of Wisconsin, USA.
April 2000—2004.12 Associate Professor, Tohoku University, Japan.
2005.0 1 Up to now, distinguished professor, Professor of Xiamen University, Min River scholar.
May 2000-present Visiting Professor of Northeastern University
200 1.03 Visiting Professor, National Huaqiao University
Former director of the Department of Materials Science and Engineering, Xiamen University,
In September 2007, he served as Dean of the School of Materials Science of Xiamen University.
Director of Research Center for Materials Design and Applied Engineering of Xiamen University, director of Xiamen Key Laboratory of High Performance Metal Materials.
Research direction:
1 design theory of metal materials
2 semiconductor packaging materials, etc.
The main research direction is metal material design theory (including group variational method, phase field theory and phase diagram calculation, etc.). ), electronic packaging materials, metallic glass materials, new composite materials and so on. Its main research idea is to study the structure and properties of materials on the basis of material design, and then develop new metal materials. The main research results are as follows:
(1) Successfully developed a thermodynamic database of lead-free solder for electronic packaging, from which information such as phase equilibrium, surface tension, viscosity and interface reaction can be predicted, and it has been commercialized and won the Japan Technology Development Award;
(2) The successfully developed high-performance thermodynamic database of copper-based alloys provided an important foundation for the development of electronic materials, and won the best paper award in the field of international alloy phase diagrams in 2004;
(3) On the basis of material design, self-assembled composite powder materials were developed, and the results were published in the journal Science.
At present, research work has been carried out in the following aspects:
Establishment of thermodynamic database of (1) cobalt-based alloy:
(2) Design and preparation of metallic glass materials;
(3) Using the phase field theory to simulate the change of material structure;
(4) Material science research on the formation mechanism of layered earth.
Outstanding achievements:
1 Winner of National Outstanding Science Foundation
Two distinguished professor, Fujian "Minjiang Scholars".
Main papers in recent years: experimental study and thermodynamic calculation of phase equilibrium of sn-au-ni system, Journal of Electronic Materials, vol. 34 (2005), pp. 670-679. Miscibility Gap of B2 Phase in NiAl-Cu3Al Cross Section of Cu-Al-Ni System, Intermetallic Compounds, Vol. 13 (2005), pp. 655-66 1. Thermodynamic calculation of phase diagram and phase stability of nano-sized particles, International Journal of Modern Physics B, Vol. 19,No. 15- 17, (2005), pp. 2645-2650. Formation of Macro Morphology of Core in Cu-Fe-based Alloy with Liquid Miscibility Gap, Journal of Metallurgy and Materials A, Volume 35A (2004), Page 1243- 1253. Encyclopedia of iron-copper nano-alloying, nano-science and nano-technology. H. S. Nalwa, American Science Press, Volume 3 (2004), Page 32 1-333. (Invited paper) Interface reaction and microstructure of Cu substrate and molten Sn-based solder, Journal of Materials, Vol.45 (2004), pp.646-6 5 1. Experimental study and thermodynamic calculation of Cu-Sn and Cu-Sn-Mn systems, Journal of Metallurgy and Materials A, Vol. 35A (2004), p.164/-1654. Phase diagram of electronic materials and use of thermodynamic database, JOM, Volume 55 (2003), pp. 53-59. (Invited summary paper). Thermodynamic database of micro-solder and copper-based alloy system, Journal of Electronic Materials, vol. 32 (2003), pp. 1265- 1272. Formation of immiscible alloy powder with egg-shaped microstructure, Science, Volume 297 (2002), pp. 990-993. Experimental determination and thermodynamic calculation of phase equilibrium and surface tension of Sn-Ag-In system, Journal of Electronic Materials, vol. 3 1 (2002), pp.139-1151. Using computational thermodynamics, mechanics and scientific and experimental materials engineering to design micro-soldering materials in electronic packaging. Zhou Yongcheng et al., Science Press, new york, (200 1), pp. 334-337. Experimental determination and thermodynamic calculation of phase equilibrium of Cu-In-Sn system, Journal of Electronic Materials, vol. 30 (200 1), pp. 1093- 1 103.