In 1992, 1995 and 200 1, he received his bachelor's degree, master's degree and doctor's degree respectively from Dalian University of Technology.

1998-200 1 Electronic Packaging and Assembly Center of City University of Hong Kong;

2003-2004 Electronic Packaging Materials Center of Korea Institute of Science and Technology;

From 2004 to 2006, IZM Chip Connection and Advanced Packaging Department of German Institute of Microelectronics and Microsystems Integration conducted research.

In 2006, he returned to China as a professor.