It has no effect on the use of single chip microcomputer. The performance of single chip microcomputer is the same, but the packaging form is different. DIP is a dual in-line package, and the leads from the chip are relatively long, which can be inserted into the circuit board for soldering. SOP is in the form of patch, and the leads from the chip are relatively short, so they are not inserted on the circuit board, but pasted on the surface of the circuit board with solder. I'll send you a long picture, and you'll understand that this is DIP? package