Current position: Professor and doctoral supervisor of Department of Materials Science and Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology; Professor, Department of Optoelectronic Materials and Micro-nano Manufacturing, Wuhan Optoelectronic National Laboratory (2004-present). Hubei CPPCC member (since 200 1).
He used to be a researcher and visiting professor in Department of Electronics, City University of Hong Kong, Professor of Flexibility Introduction, Shanghai Jiaotong University (2003-2005), Secretary-General of Analysis and Testing Center, Huazhong University of Science and Technology (2000-2004), Deputy Director of Department of Materials Science and Technology, Huazhong University of Science and Technology (1996-2006), and Deputy Director of MEMS Center, Huazhong University of Science and Technology (20065438+)
65438-0982 began to study alloy steel and its special properties, and achieved the international leading level at that time in the research of alloy steel, experimental methods and evaluation system of thermal fatigue and thermal wear, and won national, provincial and scientific and technological progress awards in three projects. Since 1990, the research direction has turned to the study of material surface modification and thin film, and the laboratory of film on the surface of material has been established, and the RF plasma chemical vapor deposition equipment has been successfully developed. He has done in-depth research on ion plating titanium nitride, film alloying and diamond-like carbon films, and published many high-level articles.
1997- 1999, in 2002-2003, he was employed as a researcher in the Department of Electronic Engineering of City University of Hong Kong, engaged in advanced electronic packaging and assembly research, focusing on the packaging structure and reliability of SMT, BGA, flip chip, MCM and COB. 1998 assisted the school to apply for the largest grant research plan from the Hong Kong government to the university, and established the Electronic Packaging and Assembly Reliability and Failure Analysis Center (EPA Center), which has now developed into several famous packaging research centers in the world. I go to the City University of Hong Kong regularly for more than one month every year.
From 2003 to 2005, he was employed as a professor of flexible introduction in Shanghai Jiaotong University, and engaged in advanced electronic manufacturing research in the Institute of Robotics, School of Machinery and Power. The establishment of the Advanced Electronic Manufacturing Center of Shanghai Jiaotong University has greatly developed the research of Shanghai Jiaotong University in the field of electronic manufacturing. Establish Philips-Jiaotong University Joint Laboratory in the field of electronic manufacturing. We have established long-term cooperative relations with Intel (Shanghai), GE Company and Samsung Express Semiconductor Company, and sent many doctoral students to participate in the cooperative research and joint training of the company.
During my work in Hong Kong and Shanghai, I was fortunate to have extensive exchanges and cooperation with electronic manufacturing enterprises in the Pearl River Delta and the Yangtze River Delta, and promoted the latest electronic packaging and assembly technology. We have done a lot of concrete work in reliability research and failure analysis of integrated circuit packaging, computer motherboard manufacturing, computer boards, mobile phones, miniaturized digital imaging equipment and other products, and gained very valuable experience. During this period, the world electronics industry began a period of great change. The wide application of area array packaging structure has brought revolutionary changes to the electronic manufacturing industry, and civil electronic products have been widely popularized. There is a great contrast between the rapid development of electronic manufacturing and the serious shortage of talents in the field of electronic manufacturing. After years of research and exchange, the theoretical system, technical foundation and corresponding talent training scheme related to electronic manufacturing have been gradually formed and established. How to vigorously promote the training of electronic manufacturing talents has become the main work in recent years. In 2002, at the invitation of Chalmers University in Sweden, he visited and lectured in Northern Europe, and conducted cooperation and exchanges in the fields of fine-pitch anisotropic conductive adhesive technology and lead-free packaging technology. In 2006, he was invited to visit Japan and gave an academic lecture on the brittleness of solder joints in electronic packaging. Invited to teach in domestic enterprises such as Huawei, ZTE, Fiberhome, Bird and many foreign-funded enterprises, and vigorously promote microelectronic packaging in China's electronic manufacturing technology. Participated in hosting many international conferences, including International Conference on Electronic Packaging Technology (ICEPT), International Conference on Green Electronic Manufacturing in Asia (AGEC) and International Conference on Reliability and Effectiveness of Electronic Products (ERL). Many courses on packaging are offered for undergraduates and postgraduates, including introduction to advanced electronic manufacturing, SMT technology, packaging materials, electronic packaging and photoelectric packaging, introduction to large-scale integrated circuit technology, flip-chip technology and BGA technology (area array packaging technology). Courses such as surface engineering, materials science foundation, physical properties, detection and control, heat treatment technology and equipment, and computational materials science are often offered for undergraduates and graduate students. He has a wide range of hobbies. 1996-200 1 As the chairman of the trade union of the Institute of Materials, he organized a variety of cultural and sports activities. He likes classical music, folk vocal music, acoustics and audio-visual, as well as cooking in southern China. I especially appreciate the folk garden art in China.