The PCB manufacturing process can be roughly divided into the following twelve steps, each of which requires a variety of processes. It should be noted that boards with different structures have different processes, and the following process is the complete manufacturing process of multilayer PCB;

First, the inner layer; Mainly to do the internal circuit of PCB circuit board; The production process is as follows:

1, board cutting: cutting the PCB substrate into production dimensions;

2. Pretreatment: clean the surface of PCB substrate to remove surface pollutants.

3. Film pressing: stick the dry film on the surface of PCB substrate to prepare for the subsequent image transfer;

4. Exposure: the coated substrate is exposed by ultraviolet light with exposure equipment, so that the image of the substrate is transferred to the dry film;

5. DE: Developing, etching and demoulding the exposed substrate to complete the manufacture of the inner layer board.

Second, internal inspection; Mainly to detect and repair the board circuit;

1, AOI:AOI optical scanning, which can compare the PCB image with the recorded data of good products, so as to find defects such as cracks and depressions on the board image;

2. VRS: The bad image data detected by AOI is transmitted to VRS, and relevant personnel will maintain it.

3. Wire repair: weld gold wires in gaps or depressions to prevent electrical defects;

Third, suppression; As the name implies, multiple inner plates are pressed into one plate;

1, browning: browning can increase the adhesion between the board and the resin and increase the wettability of the copper surface;

2. Riveting: cut the PP into small pieces with normal size, so that the inner panel matches the corresponding PP..

3. Film covering, shooting, gong trimming and polishing;

Fourth, drilling holes; According to the customer's requirements, holes with different diameters are drilled with a drilling machine, so that the holes between the plates are connected, which is convenient for the subsequent processing of plug-ins and also helpful for the heat dissipation of the plates;

5. Primary copper; Copper plating is carried out on the drilled holes of the external board to make all layers of lines of the board conductive;

1, deburring line: deburring the edge of the plate hole to prevent poor copper plating;

2. Glue joint removal: remove the glue residue in the hole; So as to increase the adhesion in the micro-etching process;

3. Copper (pth): Copper plating in the hole makes each layer of the board conductive, and at the same time increases the thickness of copper;

Sixth, the outer layer; The outer layer is basically the same as the inner layer in the first step, and its purpose is to facilitate the subsequent process to manufacture the circuit;

1, pretreatment: clean the board surface by pickling, grinding and drying to increase the adhesion of dry film;

2. Film pressing: stick the dry film on the surface of PCB substrate to prepare for the subsequent image transfer;

3. Exposure: ultraviolet irradiation is carried out to make the dry film on the plate form polymerized and unpolymerized states;

4. Development: dissolving the unpolymerized dry film in the exposure process, leaving gaps;

Seventh, secondary copper and etching; Secondary copper plating and etching;

1, copper 2: electroplating pattern, where the dry film is not covered in the hole, chemical copper shall be applied; At the same time, the conductivity and the thickness of copper are further increased, and then tin plating is carried out to protect the integrity of lines and holes during etching;

2.SES: Etching off the bottom copper in the area where the outer dry film (wet film) is attached through process treatment such as film removal, etching and tin removal, and completing the outer circuit;

Eight, solder resist: it can protect the circuit board and prevent oxidation;

1, pretreatment: pickling, ultrasonic water washing and other processes are carried out to remove the oxide on the plate surface and increase the roughness of the copper surface;

2, printing: covering the part of the PCB that does not need to be soldered with solder resist ink for protection and insulation;

3. Pre-baking: drying the solvent in the solder resist ink and hardening the ink for exposure;

4, exposure: curing the solder resist ink by ultraviolet irradiation, and forming a high polymer by photosensitive polymerization;

5, developing: removing the sodium carbonate solution in unpolymerized ink;

6, post-baking: the ink is completely hardened;

Nine, the text; Printed words;

1, pickling: clean the surface of the plate, remove surface oxidation, and strengthen the adhesion of ink;

2. Text: printed text is convenient for the subsequent welding process;

X. surface treatment OSP；; Coating an organic film on the side of bare copper plate to be welded to prevent rust and oxidation;

XI。 Forming; Make the plate shape required by customers, which is convenient for customer patch assembly;

Twelve, flying needle test; Test the circuit of the board to avoid the short circuit board from flowing out;

Thirteen. FQC； Final inspection, complete sampling inspection after all processes are completed;

14. Packaging and delivery; Vacuum package PCB board, package and deliver, and complete delivery;