Automobile category

1, SOC: Boundless Journey, Huixi Intelligent, Ouye Semiconductor, Core Intelligence, Ai Xin Yuan Zhi, Horizon, Fu Rui Microelectronics, Hisilicon, Black Sesame, Core Machine Technology, Core Chi Technology, Thick Mold Intelligence, Yixing Intelligent, Core Technology, Fast Microscopy, Superstar Future, CAMBRIAN Xingge, Crystal Technology.

2. Millimeter-wave radar chips: Chiff Microelectronics, Gartland, Core Valley Microelectronics, Sheng Dewei, Microchip Innovation, Si Dian Wei, Mu Ye Microelectronics and Dexin Intelligent.

3. Ultrasonic radar chips: Yudas and Audi.

4.MCU: BYD Semiconductor, chipways, Xinwei, Huada Semiconductor, Saiteng Microelectronics, Moxin Semiconductor, Xihua Technology, Zhixin Semiconductor, Zhao Yi Innovation, Jiefa Technology, National Technology, Yingdi Core Micro, Core Titanium Technology and Qi Xian Semiconductor.

5.CIS: Will, Stevie, Gekewei, Yuan Shixin, Xinshida, Chuangshi Microelectronics.

6. Lidar chips: Changrui Optoelectronics, Yingxun Core Optics, Core Sijie, Moll Core Optics, Intelligent Photoreceptor, Bosheng Optoelectronics, Core Vision, Core Wisdom Technology, Core Optics, and Changguanghua Core.

7. Other on-board sensor chips: Everbright Chip, Xunjie Electronics, Saizhuo Electronics, Huibeichuan, Wei Long Science and Technology, Shengmai Electronics, Naxinwei and Maestro.

8. Transmission chips: ruitai Microelectronics, Yu Tai Microelectronics, Guo Ketianxun, Kangzhi Integration, Longxun, Ruifak Semiconductor, Renxin Technology, Jinglve Semiconductor, Shouchuan Microelectronics and Kungaoxin.

9. Display driver chips: Zhixing Moto, Jichuang North, Yisiwei and Moxing Semiconductor.

storage class

1, NOR Flash: Hengshuo Semiconductor, Core World, Wuhan Xinxin, Boya Technology, Douzi Technology, Nuocunwei, Zhongtian Hongyu, Zhao Yi Innovation, Puran Semiconductor, Fudan Microelectronics, Eastcom Semiconductor and Chen Ju Semiconductor.

2.NAND Flash: Changjiang Storage, Zhixun Innovation, Zhao Yi Innovation, Eastcom Semiconductor and Fudan Microelectronics.

3.DRAM: Hefu Changxin, Ziguang Guo Xin, Fujian Jinhua, Sheng Weixu, Gaozhen Technology, Zhao Yi Innovation, Eastcom Semiconductor and Beijing Zheng Jun.

4. Storage module: Budweiser Storage, Yiheng Chuangyuan, Jiahe Jinwei, Jiangbolong, Jintaike, Zhiyu Technology, Zeshi Technology and Shishi Creativity.

5. New storage: Xinyuan Semiconductor, Ruike Microelectronics, Beat Byte, Eternal Storage Technology, Chituo Technology, Weber Logic.

6. Main control chips: Ren Ying Science and Technology, Tenafei, Pengti Technology, Derui Lingxin, Li Anyun Science and Technology, Deyi Microelectronics, Yixin Technology, Green Core Semiconductor, Dapu Microelectronics, Jiangsu Huacun, Yuheng Technology, ScaleFlux, Gu Wei Information and Guo Kewei.

Sensor category

Sigma Microelectronics, Everbright Core Industry, Lexus Technology, Tianyi Hexin, Lingmingguangzi, Huiwen Technology, Ronghe Technology, Juyou Intelligent, Li Si Technology, Shendi Semiconductor, Zengxin, Maxim Semiconductor, Heguang Technology, Ruishi Technology, Controlmicro, Universal Micro, Xima, Micro-Nano Sensing, Ding Hui Technology, Minxin Shares, Naxinwei, Shi Sheng.

Analog chip

1. Signal chain: 1 Line Technology, Ivy Electronics, Weil, ruitai Microelectronics, Sirup, Shanghai Belling, Fourier Electronics, Silanwei, Dio Microelectronics, Taorun Semiconductor, Analog Semiconductor, Air-core Microelectronics, Core-in-Core Interconnection, Chuantu Microelectronics, Microecology Semiconductor and Jiutian Ruixin.

Shanhai Semiconductor, Rongrong Microelectronics, Yingbisen, Lingxi Micro, Zhijingwei, Mengrui Technology, Xunxin Microelectronics, Surging Microelectronics, Atomic Semiconductor, Graphite Microelectronics, Nanocore Micro, Xinhai Technology, Core Semiconductor, Singino, and Runshi Technology.

2. Power management chips: Sheng Bang, Buwa Technology, Jiehuate, Core Enjoy, Lixin Micro, Weiyuan Semiconductor, Everbright Semiconductor, Huiyixin, Baker Microelectronics, Nanxin Semiconductor, Shanghai Duff, Cinda Electronics, Silijie, Xinhe Electronics, Rong Zhi Technology, Canrui Semiconductor, Xinmai Semiconductor, Huatai Semiconductor, Huinengtai, Silicon Energy and Digital.

Yu Tai Semiconductor, Yao Xin Technology, Chengling Microelectronics, Yichong Wireless, Hong Yixin, Ainuo Semiconductor, Xinpengwei, Fuman Electronics, Jingfeng Mingyuan, Wei Ming Microelectronics, Xiwei Microelectronics, Yingjixin, Saiwei Microelectronics, Core Conductor Technology and Biyi Microelectronics.

Power semiconductor

1. Silicon-based: Lin Zhong Electronics, Solitech Depp, Daxin Semiconductor, Anjian Semiconductor, Yaoxinwei, Changjing Technology, Huarui Microelectronics, Ruijun Semiconductor, BYD Semiconductor, Core Long March, Lu Xin Electronics, Core Energy Semiconductor, Shangyangtong and Junxin Technology.

Keda Semiconductor, Zhao Wei Semiconductor, Success Semiconductor, Wang Rong Semiconductor, Jingneng Microelectronics, Ruineng Semiconductor, Hongwei Technology, Xinjieneng, Silanwei, Semiconductor Technology, Dongwei Semiconductor, Perry, Starr Semiconductor, CRRC Times Electric, Jiejie Microelectronics and Yangjie Technology.

2. The third generation semiconductor gallium nitride: Innoseco, Chang Fei Advanced, Zhan Jing Semiconductor, Suzhou Nengxun, Nenghua, Julicheng, Silanwei, COVID-19, Huagong, China Resources Micro, Gallium Future, Junengchuang Core, Sirius Core, Wuyue Semiconductor, Core Trunk, Jingtong Semiconductor, Han You, Youjia Technology, Silicon Nitride Technology, Shanghai Belling, etc.

3. Silicon carbide of the third generation semiconductor: Chang Fei Advanced, CRRC Era Electrical, Basic Semiconductor, Guangxin Runze, Tyco Tianrun, Century Guangjin, Han You, Zhanxin, Qingxin Semiconductor, Yangjie Technology, Core Trunk, Wide Energy Semiconductor, Starr Semiconductor, Songjie, Jieping, Xingan Technology, Pure Semiconductor, Green Energy Core Innovation, Dongwei Semiconductor, Senguoke, etc.

Data center class

1. Switch chips: Rotating Core Semiconductor, Ke Sheng Network, Nanfei Microelectronics, Shengxin Network and Yunhezhi Network.

2.DPU: Zhongke Wanghai, Zhongke Yushu, Xingyun Zhilian, Dayu Zhilian, Baoyun Zhineng, Yi Sixin Technology, Core Qiyuan, Yunmai Xinlian, Pairi Technology, Core Singularity, Momentum Technology, Shencun Technology, and Qingxin Semiconductor.

3.CPU: Yizhi Electronics, Saiyun Technology, Benxin Technology, Tengfei Information, Guang Hai Information, Zhao Xin, Yuxian Microelectronics, Hong Jun Microelectronics, Computing Technology, Yun Jian Semiconductor, Digital Crossing Information Technology and Loongson Zhongke.

4.GPU: Moore Thread, Core Technology, Core-pupil Semiconductor, Jin Hang Technology, Deep Flow Microscopy, Velocity Microscopy, Glenfid, Lishu Technology, Zhihui Microelectronics, Xiang, Haifeike, Microelectronics, Jing Jiawei and Rui Xinshi.

5.FPGA: Jingwei Qi Li, Ziguang Tongchuang, Zhiduojing, Gaoyun Semiconductor, Zhongke Yihaiwei, Yige Technology, Shu Fei Technology, Yi Lin Si, Fudan Microelectronics and Anlu Technology.

6.GPGPU/AI Acceleration Chip: Silang Technology, Sim Computing, Hu Bo Semiconductor, Bitland, Easy Thinking, Suiyuan Technology, Baidu Kunlun, Kunyun Technology, Ink Core Artificial Intelligence, Linxi Technology, Cambrian, Zhu Yi Technology, Beech Technology, muxi Technology, Tianzhixin Technology and Denglin Technology.

7. Optoelectronic chips: Changrui Optoelectronics, Orange Microelectronics, Yixin Source, Mixin Technology, Xizhi Technology, Core Sijie, Yingsijia, Guangzi Information Technology, Aoke Optoelectronics, Feiang Innovation, Xiamen University Xun You, Saile Optoelectronics, Core Wave Microelectronics and Sensitive Semiconductors.

Guangte Technology, Yuan Jie Semiconductor, Core Fast Link, Hong Xin Technology, Changxinsheng Zhilian, Shen Rui Technology, iResearch Optoelectronics, Bosheng Optoelectronics, Qixin Optoelectronics, Sanan Optoelectronics, Ruishi Technology, Xinyi Technology, Huizong Guangxin, Taizhou Huaxin.