To have the basic knowledge of organic circuits and electronics, you must have some relevant work experience, whether it is mechanical maintenance or not, mainly to form maintenance thinking and participate in special circuit board maintenance training. According to many users' feedback, the course of industrial circuit board maintenance in Wang Wenzhong is good, and the most important thing is to have a lot of practice.

Compared with the traditional packaging, the circuit board adopts surface mount components, which can reduce the area of the circuit board, facilitate batch processing, have high wiring density, greatly reduce the chip resistance and lead inductance of the capacitor, and have great advantages in high-frequency circuits. Surface mount components are inconvenient in that they are not convenient for manual welding.

First of all, it is necessary to judge the fault of the circuit board, usually by observation, component measurement and circuit analysis, and then replace the damaged components. Circuit board maintenance is also called chip maintenance technology. It is a professional technology that can complete circuit detection, component detection, fault judgment and maintenance of circuit boards without drawings.

Extended data:

The copper foil substrate is first cut to a size suitable for processing and production.

Before pressing the film on the substrate, it is usually necessary to roughen the copper foil on the surface by brushing and etching, and then stick the dry film photoresist on it at appropriate temperature and pressure.

Sending the substrate with the dry film photoresist to an ultraviolet exposure machine for exposure. After the photoresist in the light-transmitting area of the negative film is irradiated by ultraviolet rays, polymerization will occur (the dry film in this area will be kept as a resist in the later development and copper etching steps), and the circuit image on the negative film will be transferred to the surface dry film photoresist.

After the protective film on the film surface is torn off, the unexposed area of the film surface is first developed and removed with sodium carbonate aqueous solution, and then the exposed copper foil is etched and removed with the mixed solution of hydrochloric acid and hydrogen peroxide to form a circuit.

Finally, the dry film photoresist is washed with sodium hydroxide aqueous solution.

For the inner circuit board with more than six layers (including six layers), an automatic positioning punch is used to punch out the riveting reference hole aligned with the interlayer circuit.

References:

Baidu encyclopedia-circuit board