Due to the shortage of chip manufacturing, most semiconductor manufacturing enterprises are stepping up production to meet the current market demand, so the semiconductor packaging and bonding process is very busy.

There are many processing procedures for semiconductor products, and a lot of semiconductor equipment is needed in the manufacturing process. The traditional packaging process can be roughly divided into eight main steps: back thinning, wafer cutting, wafer mounting, wire bonding, plastic packaging, laser printing, rib cutting and molding, and finished product testing.