[1], Wang Zhengdao, Liang Xiaoyan, An Minzhe, Experimental and Numerical Study on Dynamic Compressibility of Reactive Powder Concrete, Journal of Solid Mechanics, 2008; 2 1(5):420-430

Li, Wang Zhengdao, Xiong Zhiyuan, Chang Ruoni, Thermodynamic Constitutive Equation of Shape Memory Polymer, Journal of Polymers, 2009; 1:23-27

Wang Yaohui, Wang Zhendong, Zhao Xiaoxia. Fatigue life prediction based on the concept of stiffness degradation, Advanced Materials Research, 2008; 33-37: 199-204

Xiong Zhenyu, Wang Zhendong, Zhenfeng Li, Super Ning, Microscopic Mechanism of Deformation of EMC Laminates, Materials Science and Engineering A 2008496:323-328.

Wang Yonghua, Liang Xiaoyan, Wang Zhengdao, An Mingzhe, Yan Guiping. Study on impact dynamic properties of reactive powder concrete, engineering mechanics, 2008; 25( 1 1): 167- 172 .

[6] Wang Zhide and Cha Xiaodong. Viscoelastic modeling and characterization of PI/SiO2 _ 2 nanocomposite films under constant load and fatigue load, Journal of Materials Science and Engineering, 2008; 486:5 17-527.

[7] Wang Zhide, Cha Xiaodong. Creep resistance of PI/SiO2 _ 2 mixed films under constant and fatigue loads, Composite Materials Part A, 2008:39:439-447.

[8] Wang Zhengdao, Army Army. Basic and non-basic fracture of PI/SiO2 _ 2 hybrid films with thermal expansion of stress films, Applied Composites, 2007; 14:33-45.

[9] Wang Zhide, Jiang Shiqun, Potential Experimental Error in Determining CTE of Stress Film, Polymer Testing, 2007; 26( 1): 1 16- 12 1.

Wang, army. Effect of silica content on fracture toughness of polyimide/silica hybrid film; 353-358: 18 14- 18 17.

Wang and Zhao. Cyclic deformation and fracture of polyimide/silica films. international

Conference on progress and trend of engineering materials and their applications. Montreal, Canada, August 6, 2007-10,141-151.

[12] Wang Zhengdao, Jiang Shaoqing, thermal expansion coefficient of stress film. 2006 China Nonferrous Metals Exhibition; 16:s220-s225。

[13] Zheng, Jian, Yan. Li, Fu Shaoyun, Jiang Shaoqing,. Study on thermal and mechanical properties of PI/SiO2 _ 2 nanocomposite films at low temperature. Composite material part a, 2006; 37:74-79.

[14] Zheng-,Jiang Shaoqing, Jian-. Measurement of thermal expansion coefficient of stress film at low temperature. Polymer testing, 2005; 24(7):839-843.

Wang Zhidan, Lu Junjun, Li Yujun, Fu Shaoyong, Jiang Shiqun, Zhao Xiaoxia. Low temperature properties of polyimide/silica nanocomposite films. Materials science and engineering. Project b2005123 (3): 216-221.3 (1)

Effect of [16]zh. d. Wang, H.W.Weber. Kapton film on mechanical strength of TF coil candidate insulation. Mechanics of Materials, 2005; 37: 1 13- 120.

[17] Zhao Xinxin, Wang Zhengdao. Experimental study on fatigue properties of polyimide inorganic hybrid films. Engineering Mechanics 2008; 25(5) :67-72 .

[18] Lu Jianjun, Wang Zhengdao. Study on fracture toughness of polyimide inorganic hybrid film. Journal of Solid Mechanics, 2006; 27(4):403-407.

[19] Dui Guanzhuo, Wang Zhengdao, Jin Ming. China Isotropic Tensor Function Reciprocal Science Series in 2006; 36( 1):89- 102.

Wang Wenquan Wang Zhengdao. Mechanical properties of Bi series 2223 high temperature superconducting tape. Cryogenic engineering 2006: 149:54-59.

Wang Wenquan Wang Zhengdao. Effect of cladding alloying of bismuth-based 2223 strip on preparation process. Journal of Beijing Jiaotong University, 2006; 30(4): 15- 17.

[22] Wang Zhengdao, Jiang, Study on the measurement method of thermal expansion coefficient of thin films at low temperature. Cryogenic Engineering 2005: 147(5):56-58.

[23] Wang Zhengdao, Kang Aijian, Jiang. Reflections on the experimental teaching reform of "Mechanics of Materials". China Journal of Education and Teaching (Higher Education Edition) 2005; 1 1( 122):89-90

[24] Wang Zhengdao. Design of bending experiment scheme for material mechanics course. China Journal of Education and Teaching (Higher Education Edition) 2005; 1 1( 126):3 1.

Wang Zhengdao, Jiang, Li Yan, Fu. Experimental study on thermal expansion coefficient of nano-SiO _ 2/PI composite film at low temperature. Journal of Beijing Jiaotong University. 2005； 1:44-47.

Wang Zhengdao, Jiang. Study on mechanical properties of Bi _ (2223)/Ag alloy superconducting tape at low temperature. The13rd national conference on composite materials.

[27] Jiang, Wang Zhengdao. Numerical analysis of three-point bending test. The13rd national conference on composite materials. 2004: 1652- 1655.

[28] Wang Zhengdao, Jia, Duan Zhengzhong, Effect of temperature on properties of Bi _ (2223) HTS tape. Chinese physics letter. 200 1; 18(5):677-679.

Wang Zhengdao, Low temperature shear mechanical properties of G- 10CR glass cloth/epoxy laminate. Acta mechanics 2001; 33(4):53 1-534.

Wang Zhengdao, Chen, Zhou Yuqing, Duan He, Effect of temperature on Jc and N values of Bi(2223) tape. Cryonics. 2000; 40:68 1-683.

[3 1] Wang Zhengdao, Chen, Wen Huaming, Stress effect of bismuth-based superconducting tape. Physics C. 200034 1-348:2587-2588.

Wang Zhengdao, Tao Ruifeng. Low temperature mechanical properties of GH 132 high temperature alloy steel. 50438+0999; 5:27-29.

Wang Zhengdao, Zhao Lizhong, Tu Zhihua, Zhong Zhang. Measurement of linear expansion coefficient of materials at low temperature by strain gauge method. Cryogenic engineering. 1999; 1: 18-2 1.

Hu, Wang Zhengdao, Zhao Lizhong. Experimental study on dynamic mechanical properties of foamed silicone rubber. Polymer materials science and engineering. 5438+0999; 15(2) : 1 13- 1 19.