Formula 1 234 567

Process specification content /g? L- 1

Sulfuric acid (NiSO4? 7H2O)25 ~ 30 25 26 30 25 30 ~ 35

Nickel chloride (NiCl2? 6H2O)30

Sodium hypophosphite (NaH2PO2? H2O)20 ~ 25 30 24 10 10 25 18 ~ 22

Sodium acetate (nac2h3o2)15201012 ~17

Sodium citrate (Na3C6H5O7? 2H2O) 10 10 3 ~ 5

Sodium gluconate 30

Lactic acid (C3H6O3)80%/mL? l- 1 27

Propionic acid 2.2

Hydrazine sulfate 10

Lead ion (ppm) 2 2

Thiourea (ppm)2

The pH value is 4.5 ~ 554.54 ~ 64 ~ 64 ~ 54.6 ~ 5.

Temperature/℃

Deposition speed/micron? h- 1 12 ~ 15 20 20 5 ~ 10 25 10 ~ 15

Suitable matrix materials: steel, steel, ceramic, glass and steel.

Table 3- 1-5 Process Specification for Alkaline Electroless Nickel Plating

Formula 1 2345

Process specification content /g? L- 1

Nickel sulfate (NiSO4? 7H2O)25 30 40 20

Nickel chloride (NiCl2? 6H2O)30

Sodium hypophosphite (NaH2PO2? H2O) 10 25 20 35 30

Ammonium chloride 50 30

Potassium pyrophosphate 50

Ammonium citrate ((NH4) 3c6h5o7) 50

Ammonium hydroxide (NH4OH)/mL? l- 1 10 ~ 20 25 30

Brightener ND- 1/ mL? l- 1 20

Complexing agent ND-2/ mL? l- 1 40

Sodium citrate 10

The pH value is 8 ~ 9.510 ~18 ~109 ~10 or 8 ~ 8.59 ~ 10.

Temperature/℃

Time/minute 5 ~ 105 ~ 1060

Thickness/micron 0.2 ~ 0.5 1 ~ 2.58

Suitable matrix materials plastic plastic metal metal plastic

Note: Formula 4 is BLE- 1 bright low-temperature electroless nickel plating process. This solution is more stable, energy-saving and smooth than acidic solution. Low phosphorus alloy containing P2 4% can be obtained at pH = 9 ~10, and ordinary electroless nickel plating layer containing P7% ~ 8% can be obtained at pH = 8～8.5.