The invention relates to a high-temperature repairable conductive adhesive, which comprises the following components in parts by weight: epoxy resin 100, flaky silver powder 250-900, curing agent 10-50, curing accelerator 10-20, and polymethylmethacrylate micropowder 10-30. Wherein the average particle size of polymethacrylate micropowder is less than or equal to 6 um, TG.