, cen, du Qinghua, 1996, boundary element method for determining equivalent elastic modulus of cracked body, journal of solid mechanics, 17 (3): 207-2 13.
Qin Fei, Cen, Du Qinghua, 2002, Boundary Element Method for Multi-crack Propagation Analysis, Journal of Solid Mechanics, 23 (4): 43 1-438.
Qin Fei, Chen Liming. Influence of blade root size error on blade natural frequency. Journal of Mechanical Engineering.2006,42 [6]: 235-238.
Qin Fei, Yan Dongmei. Disturbance magnetic field caused by deformation of elastic half-plane problem. Journal of Beijing University of Technology. 2006，32 (4): 295-300。
,, Li Junzhi, Xia,,. Infrasound mechanism in earthquake preparation. Journal of Beijing University of Technology.2006,32 [6]:
Qin Fei, Zhang Xiaofeng, Li Ying. Dynamic stress analysis of large air-cooled steam turbine blades Journal of Beijing University of Technology. 32, 2006: 577-58 1.
Qin Fei, Li Ying, Zhang Xiaofeng. Dynamic strength evaluation of steam turbine blades based on finite element method. Journal of Beijing University of Technology. 2006，32: 765。
Qin Fei, Yan Dongmei, Zhang Xiaofeng. Disturbance magnetic field caused by tectonic deformation in geomagnetic environment. Journal of Mechanics, 2006,38 [6]: 799-806.
Qin Fei, Zhang Xiaofeng, Bai Jie, Wei Jianyou, Chen Liming. Engineering treatment method for dynamic stress calculation of circular symmetric structure. Journal of Beijing University of Technology, 2006, 32:
,, Li Junzhi, Xia,,. Study on abnormal mechanism of infrasound wave in imminent earthquake. Journal of Beijing University of Technology.2007,33 (1):
Qin Fei, Chen Liming. Coupled Vibration Analysis of Dislocated Blades and Wheels, Journal of Beijing University of Technology, 2007,33 (2):126-128.
Qin Fei, Yan Dongmei, Zhang Yang. Disturbance magnetic field of infinite tensile plate with circular hole. Journal of Solid Mechanics, 2007,28 (3): 281-286.
Qin Fei, Bai Jie, Antong. Stress analysis of drop/impact solder joint of board-level electronic package. Journal of Beijing University of Technology, 2007,33 (10):1038-1043.
Qin Fei, Wei Jianyou. Smoothing algorithm of strain measurement in digital image correlation method. Journal of Beijing University of Technology, 2008,34 (8): 815-819.
, Jin Ling, Wang. Dynamic bending experiment and numerical simulation of board-level electronic package. Journal of Beijing University of Technology, 2008,34 (Supplement): 58-62.
Antong Qin Fei. Influence of PCB bending stiffness on solder joint stress of electronic package. Journal of Beijing University of Technology, 2008,34 (Supplement): 47-5 1.
, Hu,. Dynamic mechanical properties of lead-free solder. Journal of Beijing University of Technology, 35, 2009:1009-1013.