Wang 1959 65438+ was born on125 October, and is a professor at Harbin Institute of Technology.
In July 199 1 he was appointed as an associate professor at Harbin Institute of Technology, and in July 1996 he was appointed as a professor at Harbin Institute of Technology. He put forward the concept of micro-connection in the field of welding and developed it into a new subject direction, which was applied to the field of microelectronic packaging.
Edit the role experience.
1February, 1978, he entered the undergraduate course of Harbin Institute of Technology.
1982 received a bachelor's degree in engineering in February.
1984 12 received a master's degree in engineering and stayed as a teaching assistant.
1989 12 received a doctorate in engineering.
July lecturer, 1986, July associate professor, July professor, 1996.
1July, 1999, he was hired as a doctoral tutor in materials science and engineering.
In September 2004, he was hired as a postgraduate tutor in electronic science and technology.
1993 -2000, deputy director and director of welding teaching and research section.
1995-2000 Executive Director of State Key Laboratory of Welding.
2 Master Job Editor
Director and senior member of China Institute of Electronics.
Director of China Electronic Production Technology Society
Executive director of welding branch of China mechanical engineering society
Director of micro-nano manufacturing technology branch of China mechanical engineering society
Director of Packaging Branch of China Semiconductor Industry Association
Director of Electronic Branch of China Machinery Manufacturing Technology Association
Member of Institute of Electrical and Electronics Engineers (IEEE, Inc)
Member of Harbin Science and Technology Expert Advisory Committee
Director of China Electronic Production Technology Society
Journal of Korea Welding Society International Edition: Consultant
Member of the Expert Group on the 11th Five-Year Plan and the Medium-and Long-Term Plan for the Information Industry in 2020.
Chairman of the Organizing Committee of the 6th International Conference on Electronic Packaging Technology in 2005
3 research direction editor
Advanced packaging and assembly technology, micro-connection technology research, micro-analysis of connection interface behavior, connection material design, reliability analysis of micro-connection joint, precision welding and cutting, photoelectric device packaging, low-temperature connection, computer control of connection process and quality.
4 scientific research project editor
3 projects supported by National Natural Science Foundation of China.
Study on quality control method of SMT laser welding, 1989.
Study on the principle of laser-excited ultrasonic vibration of tiny metal droplets, 1997.
Study on laser remelting principle of non-self-aligned fiber, 2004
Two pre-research projects during the Eighth Five-Year Plan.
Intelligent laser micro-welding technology, Ministry of Electronic Industry, 1992-1996.
SMT laser welding process automation and quality control, Ministry of Aerospace Industry, 199 1-1996.
Cross-industry pre-research projects in the Ninth Five-Year Plan, including 1 project.
Research on Microjunction Technology, 1996 -2000
International cooperation projects, 3 projects
MiniBGA laser reflow technology, 2000-2002, 200,000 RMB.
Melting solder spraying technology, 2000-2002, RMB 300,000.
The tenth five-year plan includes two pre-research projects.
Packaging technology of multi-chip subsystem in 2002 -2005
Precision welding technology of micro parts and functional structural parts, 200 1 -2005.
5 editors of award-winning records
Development of laser welding equipment for high-density surface assembly of microelectronic devices,1The second prize of Heilongjiang Education Commission in May, 990.
Research on microcomputer adaptive control device for spot welding quality by electrode displacement method, second prize, 9 1 12, Ministry of Aerospace Industry.
Laser welding device for high-density surface assembly of microelectronic devices,1The third prize of Heilongjiang Science and Technology Commission in September, 990.
Intelligent laser micro-welding technology, third prize, 1996, February, Ministry of Electronic Industry.
SMT laser welding process automation and quality control, second prize, 1998, 12, Aerospace Industry Corporation.
SMT Laser Welding High Reliability Solder Paste, Third Prize, 1998, 12, Aerospace Industry Corporation.
Won 2 national invention patents.