3.CSP design, materials, technology, reliability and its application in chip-level packaging. 4. Head of Engineering Department-Learn from me.
5. Director of Quality Control Department-Learn from me. Special issue of DFM manufacturability design
7.SPC operation practice 8. Electromagnetic compatibility design of electronic equipment
9. Proceedings of the13rd Annual Meeting of Electronic Components Society of Chinese Institute of Electronics, 10, Surface Mount Technology, 2003.
1 1, lead-free welding technology 12, reference for application standard of lead-free technology.
13, fundamentals of practical surface assembly technology 14, 2003-2004 SMT equipment materials and SMT components procurement user manual.
15, Advanced Technology of Modern Printed Circuits 16, Fundamentals of Electronic Technology (2nd Edition).
17, NEPCON 13, Proceedings of Shanghai International Symposium on SMT Technology 18, Microelectronic Packaging Technology.
19, lead-free soldering technical manual 20, resistor-capacitor components and chip technology.
2 1, complete handbook of circuit board design 22, EDA technology and application.
23, "Electronic Technology and Electronic Engineering Design" 24, "Six Sigma Practice"
25. Electromagnetic compatibility and the theory, design and wiring of printed circuit boards. Reliability and maintainability of electronic machinery.
27. Xue Jingcheng's Collection of SMT Application Management. 28.SMT advanced management seminar lecture.
Proceedings of 29.2003 Beijing International SMT Technology Exchange Conference. General technology of surface mount (SMT)
3 1, Proceedings of the 7th Symposium on Surface Mount Technology/Electronic Interconnection and Packaging Technology in 2003, Proceedings of the EME2003 Academic Conference of Mechanical Engineering Branch of Chinese Institute of Electronics.
33.SMT technology and manufacturability design. Fundamentals of Electronic Technology
The latest books and materials (click on the name of the material to find a brief introduction of the material).
1, "Modern Practical Electronic SMT Design and Manufacturing Technology" 2, "User's Manual for Purchasing Chip Components in the World"
3, "2002-2003 Shanghai Electronic Manufacturers Directory" 4,
5. Surface Mount Technology, Volume 6, 2002 bound volume. Fundamentals of surface assembly technology
7. Surface assembly technology. Practical surface assembly technology
9. Solder Paste 10 Printing Quality and Control and Technical Guide of Modern Electronic Technology.
1 1, design and manufacture of printed circuit (PCB) 12, reliability engineering of electronic components.
13, Proceedings of the Annual Meeting of Components of China Electronics Society 12 14, Manual of Electrostatic Protection Technology.
15, the latest SMT forum /BGA. CSP Assembly Technology 16, Collection of Dr. Li Ningcheng's Works /SMT Engineer Training Seminar.
17, SMT Engineer's Manual (Jiangsu Edition) 18, high-density, high-performance and low-cost flip-chip assembly technology.
19, proceedings of the sixth national SMT/SMD 20 seminar, proceedings of the seminar on application of lead-free solder and non-cleaning flux.
2 1, electronic industry process standard set 22, SMTAI2000 international symposium on surface mount technology.
23. Wave soldering system engineering technology of printed circuit board. Proceedings of the 2nd SMT Symposium in Western China.
25. outline of skills measurement for SMT engineers. Proceedings of the sixth annual meeting of PCB6 production technology of Chinese Institute of Electronics.
27. Acceptance Conditions of IPC-A-610C Electronic Components 28. Proceedings of the Annual Meeting of Electronic Components 1 1 Chinese Institute of Electronics.
29. Acceptance conditions of IPC-A-600F PCB 30. Proceedings of the 4th Annual Meeting of Electronic Machinery of Chinese Institute of Electronics.
3 1, Proceedings of Workshop on Cleaning-free Welding Technology 32, Example of Implementing ISO 14000 Environmental Management System.
33.SMT micro-welding process design. Proceedings of the second SMT annual meeting in Beijing.
35 lead-free solder application technology album 36. Proceedings of the third SMT annual meeting in Beijing
37. Modern microelectronic packaging technology. Proceedings of the fifth national SMT/SMD seminar.
39. Proceedings of the 4th National SMT/SMD Seminar. Proceedings of the third national SMT/SMD seminar.
4 1, Surface Mount Technology 200 1 Binding Volume 42, Proceedings of the Second SMT/SMD Symposium in Sichuan.