This study investigated diallyl phthalate packaging resin as a substitute for the humidity-sensitive epoxy resin used in current light-emitting diode (LED) displays. Considering the requirements of display resin, we choose diallyl phthalate (DAP) polymer thermosetting system to study, which has most of the required properties, but it is too fragile. Toughening comonomers including vinyl and allyl types were evaluated. A promising copolymer of DAP and methyl lauryl acrylate (80/20) is defined, which has most desirable physical and performance characteristics, plus attractive inherent light diffusion properties. Allyl comonomers such as diallyl adipate and triallyl citrate also form interesting copolymers and terpolymers with DAP.DAP/epoxy interpenetrating polymer networks, which are also explored and found to be most suitable for LED applications.
Casting is a process in which plastic parts are formed by pouring liquid resin into a cavity (mold), in which monomers are allowed to polymerize into solid materials. The polymerized solid material is then taken out of the mold. In packaging, electrical or electronic components are surrounded or enclosed by a material, and the whole assembly does not need to be completely surrounded. These two terms are often used interchangeably.
Novel Toughened Olefin Resin Encapsulated Phthalate Electronic Display Device
In this study, it is mainly studied that phthalate encapsulation resin is now used as a moisture-sensitive epoxy resin in light-emitting diode (LED) displays. Considering the requirements of the display resin to guide our selection, we mainly studied the phthalate ester (DAP) polymer, which is the most ideal but too fragile thermosetting system. Toughening comonomers used for evaluation include ethylene and allyl. The promising definitions of copolymer and dodecyl acrylic acid (80/20 of DAP) in terms of physical and performance characteristics, plus fascinating inherent characteristics. Diffuse light, such as comonomer, hexene, propylene, etc. Interesting copolymers of triallyl citric acid, terpolymer and DAP DAP/ epoxy resin were also formed. The interpenetrating polymer network was discussed, and the most suitable LED application was found.
Casting is a process. In this process, plastic parts are molded. I pour a cavit liquid resin (mold), where polyacrylic acid monomer can be converted into solid matter. Then the solid material is polymerized from the mold. In packaging, electrical or electronic components are surrounded by packaging materials, and the whole assembly does not need to be completely surrounded by potting compounds. Usually, these two terms can be used interchangeably.
That's enough. I hope it helps you.