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How to write a good paper on pcb manufacturing process design
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working procedure

-Pore formation: 1. Numerical control drilling

2. Beer Cave

-Image transmission: 1. silk-screen printing

2. Dry film

-Perforated copper: 1. Chemical copper.

2. Electroplating copper

-solder resist ink: 1. Screen printing.

2. Photosensitivity

-Surface treatment: 1. resin

2. Anti-oxidation

3. Silver/carbon oil connecting bridge

4. Silver/carbon oil injection hole

5. White printing

Tin spraying

(add lead-free HAL)

7. electrolytic nickel/Kim

8. Nickel/gold precipitation

9. Goldfinger

-External processing: 1. Inclined edge cutting

2. Computer Gong

3.v-shaped incision

4. Die dropping