It is reported that in 65438+February 65438+February, Intel announced three new technologies through several research papers at the IEEE International Electronic Equipment Conference (IEDM), which continued Moore's Law from three directions: quantum physics breakthrough, new packaging and transistor technology.
Among them, Intel's new 3D stacking and multi-chip packaging technology Foveros Direct can increase the density of connection points between upper and lower chips by 10 times, and the spacing between each connection point is less than 10 micron. The new packaging method can stack NMOS and PMOS together and connect them closely, thus improving the transistor density of the chip in space; This method can increase the transistor density by 30% to 50% without reducing the process, and make Moore's Law come into effect again.
In the past few years, Intel lost to TSM. The United States and Samsung Electronics make smaller and faster chips. Today, Intel is doing everything possible to regain its leading position in the field of chip manufacturing.
Previously, Pat Gelsinger, as the CEO of Intel Trust Company, launched a series of business development plans to regain its dominant position in 2025. This time, the company's technical team launched a series of "technical weapons" that will help Intel maintain its technological advantage after 2025.
Paul Fischer, director and senior engineer of Intel's component research group, said that by stacking semiconductor components one after another, Intel's technical team can save chip space. "We are reducing the length of the internal connection channels of the chip, thus saving energy consumption, which not only improves the cost-effectiveness of the chip, but also enhances the performance of the chip."