The theoretical research of signal integrity analysis includes the general discussion of signal integrity, which is basically based on the research of digital circuits and studies the analog characteristics of digital circuits. It mainly includes two aspects: signal amplitude (voltage) and signal timing.
Four noise sources related to signal integrity noise:
1, single network signal quality
2. Crosstalk between multiple networks
3. Track collapse in power and ground distribution.
4. Electromagnetic interference and radiation of the whole system.
When the signal in the circuit can reach the receiving chip pin with the required timing, duration and voltage amplitude, the circuit has good signal integrity. When the signal can't echo normally or the signal quality can't make the system work stably for a long time, the signal integrity problem appears. Signal integrity is mainly manifested in delay, reflection, crosstalk, timing, oscillation and so on. It is generally believed that when the system works at 50MHz, the problem of signal integrity will appear, and with the increase of system and equipment frequency, the problem of signal integrity will become more and more prominent. The parameters of components and PCB, the layout of components on PCB, and the wiring of high-speed signals will all cause signal integrity problems, which will lead to unstable operation of the system and even failure to work normally at all.
Signal integrity and low power consumption are particularly important considerations in the design of cellular phones. EP harmonic absorption device helps the third harmonic frequency to pass easily, and reduces the distortion and jitter to almost undetectable levels.
With the increase of output switching speed and PCB density of integrated circuits, signal integrity has become one of the problems that must be paid attention to in the design of high-speed digital PCB. The parameters of components and PCB, the layout of components on PCB, the wiring of high-speed signals and other factors will cause signal integrity problems, which will lead to unstable operation of the system or even complete failure. How to fully consider the factors of signal integrity and take effective control measures in the design process of PCB has become a hot topic in PCB design industry.
Signal integrity analysis of related books and book information
Author: (America) Bergding
About the author: Eric Bogatin received his bachelor's degree in physics from Massachusetts Institute of Technology on 1976, and his master's degree and doctor's degree in physics from the University of Arizona on 1980. Chief technical director of GigaTest laboratory. Over the years, he has held many short-term courses in the field of signal integrity, including basic principles, measurement technology and analysis tools, trained more than 4,000 engineers, and published more than 100 technical papers, columns and monographs in the fields of signal integrity, interconnection design and packaging technology.
Translator Li Yushan, currently Professor xidian university, is the doctoral supervisor of the national key discipline "Circuits and Systems" and the deputy director of the National Electrical and Electronic Teaching Base.
The author of Signal Integrity Analysis puts forward the root of signal integrity problems from the perspective of practical experts, especially the solutions to the problems in the early stage of design. This is a reference book of practical value to design engineers and product leaders in the electronics industry. Its purpose is to help them find and solve the problem of signal integrity in advance, and it can also be used as a teaching guide for undergraduate and graduate students in related majors.
Signal integrity analysis comprehensively discusses the problem of signal integrity. This paper mainly describes the introduction of signal integrity and physical design, the essential meaning of bandwidth, inductance and characteristic impedance, the correlation analysis of resistance, capacitance, inductance and impedance, four practical technical means to solve the problem of signal integrity, the influence of physical interconnection design on signal integrity, the hidden solution behind mathematical derivation, and the recommended design criteria to improve signal integrity. Compared with most other similar books, this book emphasizes intuitive understanding, practical tools and engineering practice. With an entry-level approach, readers can easily understand the essence of physical interconnection affecting electrical performance, so as to master the signal integrity design technology as soon as possible.
Eric Bogatin, the author of The Translator's Preface, has more than 20 years of experience in signal integrity research, interconnection design and engineer training. In the book, the author reveals the root of the signal integrity problem with a unique engineering perspective and an entry-level method, helping readers to find a solution to the signal integrity problem as soon as possible in electronic design. This book is his masterpiece in the field of signal integrity, with distinctive features and strong readability. The main readers are electronic design engineers.
At present, electronic systems and circuits have entered the field of high-speed and high-frequency design above 1 GHz. On the premise of realizing the functions of VLSI chip, PCB and system design, the problem of signal integrity with performance attributes has become the bottleneck of electronic design. There are many achievements in theoretical research, engineering practice and EDA software abroad.
When people talk about printed circuit board (PCB) and IC package design, they often think of circuit design, layout design, CAD tools, heat conduction, mechanical engineering and reliability analysis. With the modern digital electronic system breaking through the barrier of 1 GHz, both PCB board-level design and ic package design must consider the issues of signal integrity and electrical performance.
Anyone involved in physical design may affect the performance of the product. All designers should understand how design affects signal integrity, and at least be able to communicate with engineers who specialize in signal integrity.
The traditional design method is to develop a product prototype according to the requirements, and then test and debug it.
Introduction The development of electronic industry is governed by simple classical laws: Moore's law first gives the development direction of electronic products-smaller, faster, cheaper and shorter research and development cycle. The requirements of end users force all suppliers of semiconductor products to abide by this law.
With the development of lithography and IC manufacturing technology supporting Moore's Law, the size of on-chip features is decreasing. This reduction has two far-reaching effects: first, the number of wafer gates is increasing, so that it can have stronger functions on wafers with the same cost and size. Second, when the channel length of the gate decreases, the switching time of the gate decreases. Short switching time means that the rise time of the output driver is shorter and the clock frequency can be higher.
Brief introduction of signal integrity analysis in chapter 1 of the catalogue
Chapter 2 Time Domain and Frequency Domain
Chapter 3 Impedance and Electrical Model
Chapter 4 Physical Basis of Resistance
Chapter V Physical Basis of Capacitance
Chapter VI Physical Basis of Inductors
Chapter VII Physical Basis of Transmission Lines
Chapter VIII Transmission Line and Reflection
Chapter 9 Loss Line, Rising Edge Degradation and Material Properties
Chapter 10 Crosstalk of Transmission Line
Chapter 1 1 Differential Pair and Differential Impedance
Appendix A 100 General Design Principles for Minimizing Signal Integrity
Appendix B 100 Empirical Rules for Estimating Signal Integrity Effects
Appendix c references
Appendix d glossary