Magnetron sputtering can prepare thin films at low pressure and low temperature with high deposition rate, and the prepared thin films have good compactness and adhesion, so they have been widely used in mechanical, optical and electronic industries.

The uniformity of film thickness is an important index to measure the film quality and the performance of coating equipment. Any kind of film with practical application value has specific requirements for film thickness distribution. Except for a few special occasions, the film thickness is required to be as uniform as possible in most cases. In recent years, theory 2~7 or process 8 of this problem has been widely studied. For magnetron sputtering coating, the distribution of electromagnetic field and plasma density on the cathode target surface is uneven, which eventually leads to uneven sputtering and uneven deposition of target atoms. By improving the magnetic circuit layout and optimizing the target design, the uniformity of thin films can be improved. A shielding mechanism 10' can also be added to rotate the substrate by means of rotation, revolution, planetary fixture, etc., so as to improve the film uniformity. However, for the existing magnetron sputtering coating equipment, the structural parameters such as the shape of the cathode target, the magnetic circuit and the motion mode of the substrate have been determined, and it is necessary to study the influence of the deposition process on the film uniformity by adjusting the process.