1 is the first enterprise engaged in wafer-level chip packaging of image sensor chips (CCD and CMOS) in China, and its wafer-level chip packaging technology is the only technology that can be mass-produced in the application field of image sensor chips in the world, accounting for more than 40% of the market share in this field. The company is funded by the most powerful venture capital institutions in Israel and China, and has a strong industrial background and financial strength. Suzhou factory was put into production in early February 2005.